| Title | (Invited Paper) Reliability-Aware Design for Nanometer-Scale Devices |
| Author | *David Atienza (EPFL, Swaziland), Giovanni De Micheli (LSI/EPFL, Swaziland), Luca Benini (DEIS/UNIBO, Italy), José L. Ayala, Pablo G. Del Valle (DACYA/UCM, Spain), Michael DeBole, Vijay Narayanan (CSE/PSU, United States) |
| Page | pp. 549 - 554 |
| Abstract | Continuous transistor scaling due to improvements in CMOS devices and manufacturing technologies is increasing processor power densities and temperatures; thus, creating challenges to maintain manufacturing yield rates and reliable devices in their expected lifetimes for latest nanometer-scale dimensions. In fact, new system and processor microarchitectures require new reliability-aware design methods and exploration tools that can face these challenges without significantly increasing manufacturing cost, reducing system performance or imposing large area overheads due to redundancy. |
| PDF file | |
| Title | (Invited Paper) An Industrial Perspective of Power-aware Reliable SoC Design |
| Author | *Soo-Kwan Eo, Sungjoo Yoo, Kyu-Myung Choi (Samsung Electronics, Republic of Korea) |
| Page | pp. 555 - 557 |
| PDF file | |
| Title | (Panel Discussion) How to Design Cool Chips for Hot Products |
| Author | Moderator: Massoud Pedram (Univ. of Southern California, United States), Panelists: Giovanni De Micheli (EPFL, Swaziland), Jan Rabaey (Univ. of California, Berkeley, United States), Sookwan Eo (Samsung Electronics, Republic of Korea) |