| Abstract | In the foreseeable future, VLSI design will meet a couple of explosions:
power, variability and NRE (non-recurring engineering cost).
Some of the solutions for power-aware designs are covered in this talk
with relation to variability. A remedy for the NRE explosion is to reduce
the number of developments and manufacture and sell tens of millions of
chips under a fixed design. System-in-a-Package approach may embody
such possibility. Several new technologies are described to enable
3-dimensional stacking of chips to build high-performance yet low-power
electronics systems.
On the other extreme of the silicon VLSI's which stay as small as a
centimeter square, a new domain of electronics called large-area
integrated circuit as large as meters is waiting, which may open up a new
continent of applications in the era of ubiquitous electronics.
One of the implementations of the large-area electronics is based on
organic transistors. The talk will provide perspectives of the organic
circuit design taking E-skin, sheet-type scanner and Braille display
as examples. |